Investigation into the cost-effectiveness of multi-chip modules for massively parallel computing applications

Theorie und Geschichte des Philosophischen Bildes

Claus Zittel

Satellitennavigation

Claus Habiger

Wachstum Durch Innovative Geschäftsmodelle

Claus W. Gerberich

§§ 363-372; 377-382

Claus-Wilhelm Canaris

Kommunismus und Freiheit

Claus Baumann

§§ 363-372; 377-382

Claus-Wilhelm Canaris

Wachstum Durch Innovative Geschäftsmodelle

Claus W. Gerberich

§§ 343-362

Claus-Wilhelm Canaris

Nutrimetabonomics

Sandrine P. Claus

Exilforschungen Im Historischen Prozess

Claus-Dieter Krohn

Autobiografie und Wissenschaftliche Biografik

Claus-Dieter Krohn

Einfache Kartoffeln Rezepte Kochbuch

Claus Mayer

Andenken Aus Namibia

Claus Cant

Chittagong Shipwreck

Claus Leggewie

From Quantum to Classical

Claus Kiefer

Anne of Green Gables Annotated and Unabridged

W. A. J. Claus

Exile Im 20. Jahrhundert

Claus-Dieter Krohn

Kulturelle Räume und ästhetische Universalität

Claus-Dieter Krohn

Mobilising Place Management

Claus Lassen

Nutrimetabonomics

Sandrine P. Claus

Nutrimetabonomics

Sandrine P. Claus

Configuring SAP Fiori Launchpad

Claus Burgaard

Exil und Widerstand

Claus-Dieter Krohn

Fear of the Minister's Justice

Geoff Habiger

Theory and Practice of Natural Computing

Claus C. Aranha

Exil und Remigration

Claus-Dieter Krohn

Exil, Entwurzelung, Hybridität

Claus-Dieter Krohn

Anne of Green Gables Annotated

W. A. J. Claus

§§ 343-362

Claus-Wilhelm Canaris

Fundamentals of Thermodynamics

Claus Borgnakke

Anne of Green Gables Annotated and Unabridged

W. A. J. Claus

Optimierungsverfahren und PASCAL-Programme

Claus Richter

Film und Fotografie

Claus-Dieter Krohn

Kurs Allgemeine Pathologie

Jessica Claus

Bibliotheken und Sammlungen Im Exil

Claus-Dieter Krohn

Metropolen des Exils

Claus-Dieter Krohn

Bücher, Verlage, Medien

Claus-Dieter Krohn

Sprache - Identität - Kultur

Claus-Dieter Krohn

Aspekte der Künstlerischen Inneren Emigration 1933-1945

Claus-Dieter Krohn

Frauen und Exil

Claus-Dieter Krohn

Gedächtnis des Exils

Claus-Dieter Krohn

Containers in the Garden

Claus Dalby

Peor Verano de Mi Vida

Marta Claus

Halloween with Jack Is Better

Halloween Claus

Halloween with Nathan Is Better

Halloween Claus

Halloween with Francesco Is Better

Halloween Claus

Christmas and New Year Expenses Log

Santa Claus OLALEKAN

Halloween with Carlos Is Better

Halloween Claus

Halloween with Sara Is Better

Halloween Claus

Halloween with Isidora Is Better

Halloween Claus

Halloween with Alexander Is Better

Halloween Claus

Halloween with Owen Is Better

Halloween Claus

Halloween with Pedro Is Better

Halloween Claus

Unavoidable

Geoff Habiger

Stoff Fur Konflikt

Claus Spenninger

Schonend Behandeln das Gute Stück Ist 76

Claus Weber

Necessity and Proportionality in International Peace and Security Law

Claus Kreß

Gesamtwirtschaftliche Analyse Eines Prästationären MRSA-Screenings

Franziska Claus

Halloween with Paul Is Better

Halloween Claus

Halloween with Nathan Is Better

Halloween Claus

System-in-package

System design using high density packaging and multi chip modules

Etienne Hirt

Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

John H. Lau

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing ; proceedings

International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (4th 2000 Espoo, Finland)

Proceedings 1999 International Symposium on Microelectronics

International Symposium on Microelectronics (1999 Chicago, Ill.)

Multichip module technology handbook

Philip E. Garrou

Advanced Electronic Packaging

William D. Brown

Proceedings

International Conference on Multichip Modules and High Density Packaging (1998 Denver, Colo.)

Application of fracture mechanics in electronic packaging

American Society of Mechanical Engineers

Proceedings, 1997 IEEE Multi-Chip Module Conference

IEEE Multi-Chip Module Conference (1997 Santa Cruz, Calif.)

Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies

John H. Lau

Multi-chip module test strategies

Yervant Zorian

Application of Fracture Mechanics in Electronic Packaging

American Society of Mechanical Engineers

Proceedings

1997 International Symposium on Microelectronics

International Symposium on Microelectronics (1997 Philadelphia, Pennsylvania)

Proceedings

International Conference and Exhibition on Multichip Modules (6th 1997 Denver, Colo.)

Proceedings

IEEE Multi-Chip Module Conference (1996 Santa Cruz, Calif.)

1996 International Symposium on Microelectronics

International Symposium on Microelectronics (1996 Minneapolis, Minnesota)

Flip chip technologies

John H. Lau

Multichip modules with integrated sensors

W. Kinzy Jones

Ball grid array & fine pitch peripheral interconnections

Jennie S. Hwang

Multichip Modules

MCM C/Mixed Technologies and Thick Film Sensors (NATO Science Partnership Sub-Series: 3:)

W.K. Jones

Introduction to multichip modules

N. A. Sherwani

1995 International Conference on Multichip Modules

International Conference and Exhibition on Multichip Modules (4th 1995 Denver, Colo.)

Multichip module design, fabrication, and testing

James J. Licari

Routing in the third dimension

N. A. Sherwani

27th International Symposium on Microelectronics

International Symposium on Microelectronics (27th 1994 Boston, Mass.)

1994 IEEE Multi-Chip Module Conference

IEEE Multi-Chip Module Conference (1994 Santa Cruz, Calif.)

Multichip modules

Society of Photo-optical Instrumentation Engineers

EuPac '94

Proceedings, 1995 IEEE Multi-Chip Module Conference, January 31-February 2, 1995, Santa Cruz, California

IEEE Multi-Chip Module Conference (1995 Santa Cruz, Calif.)

Multichip modules and related technologies

Gerald L. Ginsberg

Electronics Packaging Forum

James E. Morris

EuPac '94

European Conference on Electronic Packaging Technology (1st 1994 Essen, Germany)

Multichip packaging and bare chip systems

Brent J. Knipfer

Electronics packaging forum

James E. Morris

Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium

IEEE/CHMT International Electronics Manufacturing Technology Symposium (13th 1992 Baltimore, Md.)

1993 IEEE Multi-Chip Module Conference McMc-93: March 15-18, 1993 Santa Cruz, California

Institute of Electrical and Electronics Engineers

Rapid thermal and laser processing

Dim-Lee Kwong

Multichip modules

Proceedings, 1992 IEEE Multi-Chip Module Conference, MCMC-92

IEEE Multi-Chip Module Conference (1992 Santa Cruz, Calif.)

Multichip modules

Ernest S. Kuh

1992 IEEE Multi-Chip Module Conference McMc-92, Proceedings, March 18-20, 1992, Santa Cruz, California

Ieee Circuits and Systems Society

Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium: Integrated manufacturing, the future is now

John H. Lau

Multichip Modules

R. Wayne Johnson

Multichip modules

R. Wayne Johnson

Multichip module (MCM) markets & applications.